Method and system for plastic package decapsulation of electronic devices
AssigneeAdvanced Micro Devices, Inc.
InventorsAhmad Ghaemmaghami, Mehrdad Mahanpour
Life of this patent
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Abstract
Aspects for a decapsulation system and technique are described. In a method aspect, a portable decapsulation system is provided beneath at least one integrated circuit device on a printed circuit board. Package decapsulation of the least one integrated circuit device occurs through acid blasting by the portable decapsulation system. The portable decapsulation system includes a beaker, fuming acid within the beaker, and a sealed fitting for the beaker and holding an electronic device being decapsulated. Capillaries within the sealed fitting through which the fuming acid is released acid blast the electronic device, and a waste tube coupled to the sealed fitting for removal of solid waste during the acid blast.
Claims7
A decapsulation system for removing plastic packaging from an electronic device, the decapsulation system comprising:
- a beaker;
- fuming acid within the beaker;
- a sealed fitting for the beaker and holding an electronic device being decapsulated;
- capillaries within the sealed fitting through which the fuming acid from the beaker is released to acid blast the electronic device;
- and
- waste tube coupled to the sealed fitting for removal of solid waste during the acid blast.
A decapsulation system for removing plastic packaging from an electronic device, the decapsulation system comprising:
- a beaker;
- fuming acid within the beaker;
- a sealed fitting for the beaker and holding an electronic device being decapsulated;
- capillaries within the sealed fitting through which the fuming acid from the beaker is released to acid blast the electronic device without utilizing an external pressure source;
- and
- waste tube coupled to the sealed fitting for removal of solid waste during the acid blast.
Dependencies are inferred from the claim text.