Photoresist dispense method by compensation for substrate reflectivity
AssigneePhilips Semiconductor, Inc.
InventorDaniel C. Baker
Life of this patent
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Abstract
In the manufacture of a semiconductor device, a method for forming a layer on a semiconductor substrate compensates for variations in wafer substrate reflectivity. The method includes providing substrate illumination and then adjusting the illumination on the substrate. The method also includes controlling the dispensation of material over the substrate as a function of the adjusted illumination. By compensating for variations in wafer substrate reflectivity, manufacturing processes can realize more consistent photoresist coatings on wafer substrates from one wafer lot to another.
Claims17
In the manufacture of a semiconductor device, a method for forming a layer over a semiconductor substrate, comprising:
- providing illumination on the substrate;
- adjusting the illumination;
- and
- controlling the dispensation of a material over the substrate as a function of the adjusted illumination.
A method for forming a layer over a semiconductor substrate, comprising:
- providing illumination on the substrate;
- detecting a level of substrate reflectivity;
- optimizing the level of substrate reflectivity by adjusting the intensity of substrate illumination;
- dispensing a material over the substrate after the substrate reflectivity has been optimized;
- and
- detecting when the dispensed material makes contact with the substrate.
Dependencies are inferred from the claim text.