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US 6,296,777 B1Granted
Structuring process
AssigneeInfineon Technologies AG
InventorsManfred Engelhardt, Volker Weinrich
Life of this patent
Estimating the term…
Abstract
A layer is structured by first applying a sacrificial layer on the layer to be structured, forming a mask with an inorganic material on the sacrificial layer, then patterning the sacrificial layer and the layer to be structured through the mask, and, finally, removing the sacrificial layer and the mask.
Claims22
A method of structuring a layer, which comprises:
- placing a sacrificial layer made of an organic material on a layer to be structured;
- forming a mask layer with an inorganic material on the sacrificial layer;
- forming a photomask on the mask layer;
- partially etching the mask layer using the photomask to remove the mask layer in areas not covered by the photomask except for a remaining thin region of the mask layer completely covering the sacrificial layer;
- removing the photomask;
- anisotropically etching the mask layer to remove the thin region to create a mask;
- structuring the sacrificial layer and the layer to be structured with the mask;
- and
- removing the sacrificial layer and the mask.
6 more elements
Dependencies are inferred from the claim text.