Chemical vapor deposition hardware and process

An apparatus for processing a substrate, comprising:

• a) an enclosure defining a process region;
• b) a substrate support member disposed in the enclosure to support a substrate thereon;
• c) a process gas inlet connected to the enclosure;
• d) an exhaust system connected to the enclosure;
• e) a shielding member disposed above the substrate support member, the shielding member comprising:
• 1) a frame member having a plurality of purge holes disposed through the frame member;
• and
• 2) an inner lip portion defining an inner opening of the frame member for shielding an edge of the substrate;
• f) a purge gas inlet connected to deliver a purge gas adjacent the edge of the substrate;
• and
• g) a heater shield disposed adjacent the frame member, wherein the heater shield defines one or more recesses therein to receive one or more alignment members and has vent holes disposed through an outer portion thereof.

An apparatus for shielding an edge of a substrate, comprising:

• a frame member having a plurality of purge holes disposed through the frame member to enable purge gas flow therethrough;
• an inner lip portion defining an inner opening of the frame member for shielding the edge of the substrate;
• a base portion extending from the frame member, wherein the base portion has an inner angled centering surface;
• and
• a heater shield disposed adjacent the frame member, wherein the heater shield has vent holes disposed through an outer portion thereof.

A method for shielding an edge of a substrate, comprising:

• a) providing a shielding member disposed above the substrate, the shielding member comprising:
• 1) a frame member having a base portion defining a recess therein and a plurality of purge gas holes disposed through the frame member to enable purge gas flow therethrough;
• and
• 2) an inner lip portion defining an inner opening of the frame member for shielding the edge of the substrate;
• b) providing a heater shield disposable on a shoulder of a substrate support member;
• c) flowing purge gas adjacent the edge of the substrate and then through the purge gas holes;
• and
• d) exhausting a portion of the purge gas through one or more vent holes disposed through the heater shield.

A method for processing a substrate, comprising:

• a) providing a processing apparatus comprising:
• 1) an enclosure defining a process region;
• 2) a substrate support member disposed in the enclosure to support a substrate thereon;
• 3) a process gas inlet connected to the enclosure;
• 4) an exhaust system connected to the enclosure;
• 5) a shielding member disposed above the substrate support member, the shielding member comprising:
• i) a frame member having a plurality of purge gas holes disposed through the frame member;
• and
• ii) an inner lip portion defining an inner opening of the frame member for shielding an edge of the substrate;
• 6) a heater shield disposable on a shoulder of a substrate support member;
• and
• 7) a purge gas inlet connected to deliver a purge gas adjacent the edge of the substrate;
• b) flowing a processing gas through the gas inlet;
• c) flowing a purge gas adjacent the edge of the substrate and then through the purge holes;
• and
• d) exhausting a portion of the purge gas through one or more vent holes disposed through the heater shield adjacent the frame member.