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US 6,295,202 B1Granted
Heatsink for actively cooled daughterboard system
AssigneeHewlett-Packard Company
InventorsSean W Tucker, Arlen L Roesner, Darren B Smith, Donald Trotter, Andrew D Delano
Life of this patent
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Abstract
A heatsink for use with an actively cooled daughterboard system. Plural transverse fins are integrally formed with a base portion. The fins are radially displaced from one another. The base portion includes a central portion that is thicker than the end portions. The thickness of the base portion and the profile formed by the outer ends of the fins vary according to radii. The inner radius associated with the central fins is shorter than the inner radius associated with the endmost fins.
Claims7
A heatsink, comprising:
- a rectangular base portion having its longitudinal dimension larger than its transverse dimension;
- tabs disposed on each longitudinal end of the base portion, the tabs for engaging retaining members disposed proximate to a socket of a motherboard;
- at least one mounting pin for anchoring the heatsink to a daughterboard;
- plural transverse fins integrally formed with the base portion and radially displaced from one another;
- wherein the base portion has end parts and a central part;
- and
- wherein the thickness of the central part is greater than the thickness of the end parts and is constant in the transverse direction but varies according to a radius in the longitudinal direction.
4 more elements
Dependencies are inferred from the claim text.