Source/drain-on insulator (S/DOI) field effect transistor using oxidized amorphous silicon and method of fabrication

A semiconductor structure comprising:

• a semiconductor body having a bulk portion of one conductivity type and a top surface;
• first and second semiconductor regions of the opposite conductivity type which are separated by a portion of the semiconductor body and which have a top surface at the same level as the surface of the semiconductor body;
• a gate region separated from the top surface of the semiconductor body by a gate dielectric layer with the first and second regions being separated by the portion of the semiconductor body below the gate region;
• and
• the first and second regions being electrically isolated from the semiconductor body except for a vertical surface of each which is located below the gate region and is in electrical contact with the bulk portion of the semiconductor body.

A semiconductor structure comprising:

• a crystalline semiconductor body of a first conductivity type;
• a polysilicon gate separated from an underlying region of the body by a gate dielectric layer of silicon oxide;
• source and drain regions of amorphous semiconductor which are of the opposite conductivity type of the body, being in contact with the body, and being separated by a portion of the body;
• and
• said source and drain regions being electrically isolated from the semiconductor body except a vertical surface of each which is located below the polysilicon gate and is in electrical contact with the bulk portion of the semiconductor body.

Apparatus comprising:

• a semiconductor body having a major surface and having a bulk portion of a first conductivity type;
• active areas of the body being surrounded by an insulating isolation region which extends from the major surface of the body into the bulk portion of the body;
• at least one of the active areas of the body containing a field effect transistor having a drain region and a source region with both regions being of the opposite conductivity type of the first conductivity region;
• each drain and source region having four side walls and a bottom surface with three of the side walls being in contact with portions of the insulating isolation region and the fourth side wall being in contact with a portion of the bulk of the body and being separated from the fourth side wall of an adjacent region by portions of the bulk of the body;
• and
• an insulating layer separating the bottom of each drain and source region from the bulk of the body.

Apparatus comprising:

• a semiconductor body having a major surface and having a bulk portion of a first conductivity type;
• active areas of the body being surrounded by an insulating region which extends from the major surface of the body into the bulk portion of the body;
• at least one of the active areas of the body containing two field effect transistors sharing a common first output region and having separate second output regions;
• each of the first and second output regions having four side walls and a bottom surface with the first and second side walls of each output region being in contact with portions of the insulating isolation region, the third side wall of each output region being in contact with a portion of the bulk of the body and being separated by portions of the bulk of the body from the a side wall of another output region by portions of the bulk of the body, the fourth side walls of the second output regions being in contact with the insulating isolation region, and the fourth side wall of the first output region being in contact with the bulk portion of the body;
• and
• an insulating layer separating the bottom of each first and second output regions from the bulk portion of the body.

A method of fabricating field effect transistors each having a drain region and a source region in a semiconductor body having a major surface and having a bulk of a first conductivity type comprising the steps of:

• patterning the body to define active areas in which transistors are to be formed;
• forming an insulating isolation region extending from the major surface of the body into the body to surround areas of the wafer in which transistors are to be formed;
• etching two trenches in at least one of the active areas with the trenches being separated by portions of the bulk of the body and with each trench having three side walls defined by portions of the insulating isolation region and having a fourth side wall and a bottom surface defined by the bulk of the body;
• covering the bottom surface of each trench with an insulating isolation cover layer;
• filling the trenches with a semiconductive material;
• and
• doping the fill semiconductive material to be of the opposite conductivity type of the bulk portion of the body such that the filled trenches become the drain and source regions of the transistor with the fourth wall side of each pair of drain and source regions being in contact with the bulk of the body and facing each other.

A method of fabricating pairs of field effect transistors each having a separate first output region and sharing a common second output region in a semiconductor body having a major surface and having a bulk of a first conductivity type comprising the steps of:

• patterning the body to define active areas in which transistors are to be formed;
• forming an insulating isolation region extending from the major surface of the body into the body to surround areas in which transistors are to be formed;
• etching first, second, and third trenches in at least one of the active areas with the trenches being separated by portions of the bulk of the body and with each trench having first and second two side walls defined by portions of the insulating isolation region and having a third side wall and a bottom surface defined by the bulk portion of the body, the first and third trenches each having a fourth side wall defined by portions of the insulating isolation region, and the second trench having a fourth side wall defined by the bulk portion of the body;
• covering the bottom of each trench with an insulating isolation layer;
• filling the trenches with a semiconductive material;
• and
• doping the fill semiconductive material to be of the opposite conductivity type of the bulk portion of the body such that the filled first and third trenches become the first output region of each of the first and second transistors, respectively, and the filled second trench becomes the common second output region of both transistors with the third and fourth side walls of the second output region being in contact with the bulk of the body and with each facing the third side wail of a separate first output region.

A method of forming in a semiconductor body having a major surface and being of a first conductivity type a plurality of insulated gate field effect transistors each having a gate, a drain region, and a source region comprising the steps of:

• forming dielectric regions from the major surface of the body into the body so as to define active areas of the surface of the body in which transistors are to be formed;
• forming in the active areas gates which are separated from the surface of the body by a gate dielectric layer;
• etching exposed portions of the surface adjacent the gates to form a trench on each side of each gate region;
• forming in bottoms of the trenches a layer of dielectric material;
• and
• depositing semiconductive material in the trenches to fill the trenches such that each trench filled with semiconductive material forms one of a group consisting of a drain region and a source region having a plurality of surfaces with one surface of each region being in electrical contact with the semiconductor body and with all other surfaces of the drain and source regions being dielectrically isolated from the semiconductor body.

A method of forming a plurality of insulated gate field effect transistors each having a gate, a source region, and a drain region with the source and drain regions being partially electrically isolated from a semiconductor body in which the transistors are formed comprising the steps of:

• forming dielectric regions from a surface of the body into the body so as to define therebetween areas of the surface of the body in which transistors are to be formed;
• forming in the areas in which transistors are to be formed gate regions which are separated from the surface of the body by a gate dielectric layer;
• forming over a top surface of the gates a layer of silicon nitride;
• etching trenches in portions of the surface of the body adjacent the gates, and then depositing thereover a layer of silicon;
• etching the deposited silicon such that it is removed everywhere except in the trenches below the level of the body underneath the dielectric regions;
• forming a layer of silicon nitride on all exposed silicon surfaces, said layer of silicon nitride being thinner than the layer of silicon nitride on the top surface of the gate regions;
• removing the silicon nitride from all horizontal silicon surfaces while leaving the silicon nitride layer covering vertical silicon surfaces, and also leaving a portion of the silicon nitride on a top surface of the gates;
• oxidizing the deposited silicon remaining in the trenches;
• removing the silicon nitride on sidewalls of the trenches which are not covered by silicon oxide, leaving a portion of the silicon nitride on the top surface of the gate regions, and then depositing thereover a layer of silicon;
• etching the deposited silicon such that the remaining deposited silicon is at the level of the surface of the body;
• etching all remaining silicon nitride from the surface of the gate regions;
• and
• doping the gate, and source and drain regions to appropriate levels and types of conductivity.

A method of forming a plurality of insulated gate field effect transistors each having gate, source, and drain regions with the source and drain regions being partially electrically isolated from a semiconductor body in which the transistors are formed, and conventional insulated gate field effect transistors, said method comprising the steps of:

• forming dielectric regions from the surface of the body into the body so as to define therebetween areas of the surface of the body in which transistors are to be formed;
• forming in the areas in which transistors are to be formed gate regions which are separated from the surface of the body by a gate dielectric layer, a top surface of the gate regions being covered by a layer of silicon nitride;
• depositing over the surface of the semiconductor body a protective layer of silicon nitride;
• removing this layer from those portions of the semiconductor body where dielectrically isolated transistors are to be formed while leaving the layer in those portions of the body where conventional transistors are to be formed;
• etching trenches in portions of the surface of the body adjacent to the gates, and then depositing thereover a layer of silicon;
• etching the deposited silicon such that it is removed everywhere except in the trenches below the level of the body underneath the dielectric regions;
• forming a layer of silicon nitride on all exposed silicon surfaces, said layer of silicon nitride being thinner than both the layer of silicon nitride on the top surface of the gate regions and the protective layer of silicon nitride;
• removing the silicon nitride from all horizontal silicon surfaces while leaving the silicon nitride layer covering vertical silicon surfaces, and also leaving a portion of the silicon nitride on the surface of the gate regions and a portion of the protective layer of silicon nitride;
• oxidizing the deposited silicon remaining in the trenches;
• removing the silicon nitride on sidewalls of the trenches which are not covered by silicon oxide, leaving a portion of the silicon nitride on the top surface of the gate regions and a portion of the protective layer of silicon nitride, and then depositing thereover a layer of silicon;
• etching the deposited silicon such that the only remaining deposited silicon is at the level of the surface of the body;
• etching all remaining silicon nitride so as to remove all silicon nitride in the protective layer and from the surface of the gate regions;
• and
• doping the gate, and source and drain regions to appropriate levels and types of conductivity.