US 6,293,291 B1 · Method and apparatus for the treatment of objects, preferably wafers

Abstract

A method for the treatment of objects, preferably wafers, in a corresponding apparatus. The apparatus having at least two or more process chambers for receiving and treating the objects as well as a handling apparatus, for example a robot arm, for loading and unloading the process chambers. To date, all the process chambers have been loaded with the objects directly in succession. Accordingly, the actual treatment begins virtually simultaneously in all the process chambers. Furthermore, the necessary cleaning processes in the process chambers are also carried out virtually simultaneously. In order to increase the throughput of objects to be treated and to prevent or to minimize the overlapping of the cleaning processes, the invention proposes that, at the program start, at the beginning of the treatment method, the loading of the objects into the first process chamber and beginning of the treatment of the objects are effected, and that, subsequently, temporally staggered initial loading of the objects into the second process chamber and beginning of the treatment of the objects are effected. The temporally staggered initial loading of the individual process chambers can be effected by manual or computer-aided control of the apparatus. Furthermore, a corresponding apparatus is described.

Claims12

Dependent claims

An apparatus for treating objects including wafers, comprising:

a plurality of process chambers including a first process chamber and a second process chamber for receiving and treating objects;
a handling apparatus constructed for loading and unloading the objects to and from said plurality of process chambers, said handling apparatus beginning, at a program start, an initial loading of the objects in said first process chamber for treatment of the objects in said first process chamber and to begin, in a temporally staggered manner with respect to said program start, an initial loading of further objects in said second process chamber for treatment of the further objects in said second process chamber;
and
said handling apparatus constructed for unloading the first objects from said first process chamber after an end of the treatment and renewed loading of further objects to be treated into said first process chamber, and unloading the second objects from said second process chamber after an end of the treatment and renewed loading of further objects to be treated into said second process chamber.

1 more element

Dependencies are inferred from the claim text.

Method and apparatus for the treatment of objects, preferably wafers

Life of this patent

Method and apparatus for the treatment of objects, preferably wafers

Life of this patent

Abstract

Claims12