Substrate structure
AssigneeMicron Technology, Inc.
InventorH. Montgomery Manning
Life of this patent
Estimating the term…
Abstract
A semiconductor substrate structure includes a conductor supported by a substrate, and has an outer surface and a pair of spaced-apart conductive sidewalls joining with the outer surface at respective corners. A first layer of material is disposed over the substrate over all of one of the sidewalls, over only a portion of the outer surface and over only a portion of the other sidewall. The first layer of material has a generally uniform thickness over the conductor outer surface, the conductive sidewalls and the corners. A second layer of material having a generally non-uniform thickness is disposed over the substrate. Such has a non-planar outer surface, and an opening therethrough to the conductor's outer surface and the other sidewall which do not have first layer material disposed thereover.
Claims11
A semiconductor substrate structure comprising:
- a substrate;
- a conductor supported by the substrate, the conductor having an outer surface and a pair of spaced-apart conductive sidewalls joining with the outer surface at respective corners;
- a first layer of material disposed over the substrate, over all of one of the sidewalls of the conductor, and over only a portion of the conductor's outer surface and over only a portion of the other of the conductor's sidewalls;
- the first layer of material being of generally uniform thickness over the conductor's outer surface, the conductive sidewalls and at least one of the corners;
- and
- a second layer of material having a generally non-uniform thickness disposed over the substrate, the second layer of material having a non-planar outer surface, the second layer of material having an opening therethrough to the conductor's outer surface and the other sidewall which do not have first layer material disposed thereover.
Dependencies are inferred from the claim text.