Nozzle arm movement for resist development
AssigneeAdvanced Micro Devices, Inc.
InventorsRamkumar Subramanian, Khoi A. Phan, Bharath Rangarajan, Bhanwar Singh, Michael K. Templeton, Sanjay K. Yedur
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AssigneeAdvanced Micro Devices, Inc.
InventorsRamkumar Subramanian, Khoi A. Phan, Bharath Rangarajan, Bhanwar Singh, Michael K. Templeton, Sanjay K. Yedur
Estimating the term…
A system and method is provided that facilitates the application of a uniform layer of developer material on a photoresist material layer. The system includes a multiple tip nozzle and a movement system that moves the nozzle to an operating position above a central region of a photoresist material layer located on a substrate, and applies a volume of developer as the nozzle scan moves across a predetermined path. The movement system moves the nozzle in two dimensions by providing an arm that has a first arm member that is pivotable about a first rotational axis and a second arm member that is pivotable about a second rotational axis or is movable along a translational axis. The system also provides a measurement system that measures the thickness uniformity of the developed photoresist material layer disposed on a test wafer. The thickness uniformity data is used to reconfigure the predetermined path of the nozzle as the developer is applied. The thickness uniformity data can also be used to adjust the volume of developer applied along the path and/or the volume flow rate.
A system for applying a developer material onto a photoresist material layer disposed on a substrate wafer to provide a uniformly thick layer of developer material, the developer material being spincoated onto the substrate wafer by a rotating chuck coupled to a motor to form the uniformly thick layer of developer material, the system comprising:
A system for applying a developer material onto a photoresist material layer disposed on a substrate to provide a uniformly thick layer of developer material, the developer material being spincoated onto the substrate by a rotating chuck coupled to a motor to form the uniformly thick layer of developer material, the system comprising:
A system for applying a developer material onto a photoresist material layer disposed on a substrate to provide a uniformly thick layer of developer material, the developer material being spincoated onto the substrate by a rotating chuck coupled to a motor to form the uniformly thick layer of developer material, the system comprising:
A system for applying a developer material onto a photoresist material layer disposed on a substrate wafer to provide a uniformly thick layer of developer material, the developer material being spincoated onto the substrate wafer by a rotating chuck coupled to a motor to form the uniformly thick layer of developer material, the system comprising:
Dependencies are inferred from the claim text.