Mounting multiple substrate frame and leadless surface mountable assembly using same

A leadless surface mountable assembly for mounting multiple substrates, comprising:

• first and second substrates having electrical circuitry disposed thereon;
• and
• a surface mountable frame, including:
• first and second surfaces, first and second cavities formed through said first and second surfaces, said first cavity designed to accommodate the electrical circuitry located on said first substrate and said second cavity designed to accommodate the electrical circuitry located on said second substrate, a plurality of electrical conductors interconnecting the first and second surfaces, said first surface having electrical contacts electrically coupled to said electrical conductors for electrically interconnecting to the electrical circuitry found on the first and second substrates.