Cast column grid array extraction apparatus and method

An apparatus for removing a casting comprising a electronic package substrate and an array of cast solder columns having a column pitch of less than 2 mm extending therefrom from the corresponding openings of a mold comprising:

• a frame;
• a removable mold containing a plurality of openings through a thickness thereof for casting a corresponding array of more than 2 solder columns having a column pitch of less than 2 mm and bonding said columns to the underside of an electronic package substrate when said substrate is disposed on said mold;
• a stripper plate on said frame for receiving said mold, said stripper plate containing more than 2 openings through a thickness thereof corresponding to at least some of the openings in said mold;
• an ejector assembly on said frame including more than 2 ejector pins extending therefrom, said ejector pins having a length at least as long as the sum of the thickness of said stripper plate at the stripper plate openings and the thickness of said mold at the column casting openings, at least some of said ejector pins corresponding to openings in said mold and said stripper plate,
• at least one of said mold and said ejector assembly being movable on said frame toward the other to cause at least some of said ejector pins to engage cast columns in the mold openings and push the engaged cast columns and substrate out of said mold.

A method of removing a casting comprising a substrate and an array of columns extending therefrom from the corresponding openings of a mold comprising the steps of:

• a) providing a compression plate having an opening therein for receiving said substrate without interference;
• b) providing a mold containing a plurality of openings through a thickness thereof for casting a corresponding array of columns and bonding said columns to the underside of a substrate when said substrate is disposed on said mold;
• c) providing an ejector assembly including a plurality of ejector pins extending therefrom, at least some of said ejector pins corresponding to openings in said mold;
• d) moving said at least one of said compression plate and said ejector assembly toward the other to cause said substrate to be received within said opening in said compression plate;
• e) engaging cast columns in the mold openings with at least some of said ejector pins;
• and
• f) pushing the engaged cast columns and substrate out of said mold and into said opening in said compression plate.