Semiconductor processing furnace

A thermal processor for treating a plurality of semiconductor articles configured in a batch processing array, comprising:

• a processing vessel which has a processing vessel wall which serves to enclose a processing chamber for treating said batch of semiconductor articles therein, said processing vessel wall having inner and outer processing vessel surfaces;
• a furnace liner which surrounds portions of the processing vessel, said furnace liner having a furnace liner wall with inner and outer furnace liner surfaces;
• a furnace heater defining at least portions of a furnace chamber having an inner furnace wall which defines at least part of a furnace chamber cavity;
• a first cooling circuit having a first fluid flow path formed between the outer processing vessel surfaces and the inner furnace liner surfaces;
• said first fluid flow path having an associated first flow which moves upwardly between the processing vessel and furnace liner;
• a second cooling circuit having a second fluid flow path formed between the outer furnace liner surfaces and the inner furnace wall;
• said second fluid flow path having an associated second flow which moves downwardly between the furnace liner and the inner wall of the furnace chamber;
• at least one fluid flow mover for moving a cooling fluid through at least one of said fluid flow paths.

A method for cooling a processing chamber of a semiconductor thermal processor during processing of a batch of semiconductor articles carried within the processing chamber, the method comprising the steps of:

• providing an array of semiconductor articles supported within a processing vessel which defines portions of the processing chamber;
• providing a furnace heater having a furnace chamber within which said processing vessel can be positioned;
• heating said processing vessel and processing chamber with said furnace heater during a thermal processing cycle so as to process said semiconductor articles contained therein;
• subsequently cooling said articles by providing:
• a first cooling fluid flow adjacent said processing vessel;
• and
• a second cooling fluid flow adjacent to said furnace heater;
• wherein the first cooling fluid flow and the second cooling fluid flow in opposing countercurrent directions.

A method for cooling a batch of semiconductor articles carried within a processing chamber of a thermal processor, the method comprising the steps of:

• providing a batch of semiconductor articles supported within the processing chamber of the thermal processor;
• providing a processing vessel about the batch of semiconductor articles to enclose the processing chamber with the batch contained therein;
• providing a furnace liner which surrounds portions of the processing vessel, the furnace liner having a furnace liner wall with inner and outer furnace liner surfaces thereon;
• providing a furnace heater having a plurality of heating elements which are adjacent to a furnace chamber, said furnace chamber having an inner wall defining a furnace chamber cavity in which the processing chamber is located;
• heating said batch of semiconductor articles contained within the processing vessel;
• cooling said batch of semiconductor articles by:
• providing a first flow of cooling fluid along a first fluid flow path which moves upwardly between the outer processing vessel surfaces and the inner furnace liner surfaces;
• providing a second flow of cooling fluid along a second fluid flow path which moves downwardly between the outer surfaces of the furnace liner and the inner wall of the furnace chamber.