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AssigneeHewlett-Packard Company
InventorsArlen L. Roesner, Guy R. Wagner, Samuel M. Babb
Estimating the term…
An enclosure for integrated circuit devices is disclosed. The enclosure includes a first portion which substantially encloses a plurality of secondary, relatively low-power integrated circuit devices and which includes a mechanism for contacting the secondary integrated circuit devices in order to conduct heat away. The enclosure also includes a second portion, which may include an active cooling device, directly in contact with a primary, relatively high-power primary integrated circuit device. In addition to removing heat, the first and second enclosure portions together shield the integrated circuit devices to contain electromagnetic energy generated by the devices. The first and second enclosure portions also allow different levels of force to be applied to the primary and secondary devices.
An enclosure mounted on a printed circuit board in proximity to at least one primary electronic component and at least one secondary electronic component which are mounted on said printed circuit board, said enclosure comprising:
An enclosure mounted on a printed circuit board in proximity to at least one primary electronic component mounted on said printed circuit board, said enclosure comprising:
A method of enclosing at least one primary electronic component and at least one secondary electronic component which are mounted on a printed circuit board, including the steps of:
Dependencies are inferred from the claim text.