Multichip press-contact type semiconductor device

A press-contact type semiconductor device comprising:

• a first group of semiconductor chips solderlessly arranged on the same plane;
• a second group of semiconductor chips, each having a control electrode solderlessly, arranged around said first group of semiconductor chips to be on the same plane as said first group of semiconductor chips;
• first and second press-contact electrode plates for press-contacting said first and second groups of semiconductor chips at the same time;
• an insulation substrate, formed between said first and second press-contact electrode plates, having openings at a contact portion between a main surface of each of said semiconductor chips of said first and second groups of semiconductor chips and said first press-contact electrode plate;
• press-contact electrodes provided on said insulation substrate to be electrically connected to the control electrode of each of said second group of semiconductor chips;
• and
• control wires, fixed to said insulation substrate, for supplying a control signal for controlling said second group of semiconductor chips to the control electrode of said second group of semiconductor chips through said press-contact electrodes.

A press-contact type semiconductor device comprising:

• a plurality of semiconductor chips, each having a control electrode solderlessly, arranged on the same plane;
• first and second press-contact electrode plates for press-contacting said plurality of semiconductor chips at the same time;
• an insulation substrate, formed between said first and second press-contact electrode plates, having openings at a contact portion between a main surface of each of said semiconductor chips and said first press-contact electrode plate;
• press-contact electrodes provided on said insulation substrate to be electrically connected to the control electrode of each of said semiconductor chips;
• control wires, fixed to said insulation substrate, for supplying a control signal for controlling said respective semiconductor chips to the control electrode of each of said semiconductor chip through said press-contact electrodes;
• and
• at least one of a resistor for preventing oscillation to be mounted on said insulation substrate, a thermistor for detecting temperature, a current detecting element for detecting an overcurrent, an overcurrent detecting circuit, and a protection circuit for protecting said respective semiconductor chips.

A press-contact type semiconductor device comprising:

• a plurality of semiconductor chips solderlessly arranged on the same plane;
• an insulation frame, provided in the main surface of each of said plurality of semiconductor chips, and having openings at positions corresponding to said respective semiconductor chips;
• a disk type heat buffer plate provided on a rear surface of said semiconductor chips;
• and
• first and second press-contact electrode plates for press-contacting said plurality of semiconductor chips at the same time, wherein said insulation frame and said disk type heat buffer plate sandwich said respective semiconductor chips from upper and lower directions, thereby positioning and fixing said respective semiconductor chips.