Thin film silicon on insulator semiconductor integrated circuit with electrostatic damage protection and method
AssigneeMotorola, Inc.
InventorsJohn H. Quigley, Jeremy C. Smith, Percy Gilbert, Shih Wei Sun
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AssigneeMotorola, Inc.
InventorsJohn H. Quigley, Jeremy C. Smith, Percy Gilbert, Shih Wei Sun
Estimating the term…
A thin film silicon on insulator circuit with a low voltage triggered, surface silicon controlled rectifier (30) for electrostatic damage protection and method is provided. A surface silicon controller rectifier (30) is formed in a thin device layer (130), overlying a buried insulation layer (110) and electrically coupled to a low voltage trigger apparatus (36). In one embodiment, a zener diode is employed as the low voltage trigger apparatus (36), and in another embodiment low voltage trigger apparatus (36) is an n-channel MOSFET.
A thin film silicon on insulator semiconductor integrated circuit with electrostatic damage protection comprising:
A method of protecting integrated circuits formed in thin film silicon on insulator substrates from electrostatic damage, comprising:
A method of forming a low voltage triggered silicon controlled rectifier on a thin film silicon on insulator substrate comprising the steps of:
Dependencies are inferred from the claim text.