Photoimageable, dielectric, crosslinkable copolyesters
AssigneeThe Board of Trustees of the University of Illinois
InventorsJames Economy, Lizabeth A. Schneggenburger, Fang Shi
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Abstract
Photosensitive, dielectric insulating, crosslinkable copolyester films used as dielectric and as photoresist films for microelectronics circuits which are also suitable for use in producing MCM-L packages. In various embodiments of the invention there is provided photosensitive, dielectric insulating, crosslinkable copolyester film forming mixtures for coating onto microelectronics substrate surfaces, a photosensitive oligomer for producing the crosslinkable copolyesters and MCM-L products produced using the crosslinked copolyesters.
Claims6
A mixture for forming a film of a photosensitive, dielectric insulating, crosslinkale copolyeser, said mixture comprising:
- (a) at least one oligomer having functional carboxylic acid end groups capped with methacryl groups, and
- (b) at least one oligomer having functional acyloxy end groups, in a film-forming solvent for said oligomers, and wherein one of the oligomers has more than two of said functional end groups present in the oligomer for functioning to form said copolyester.
A mixture for forming a film of a photosensitive, dielectric insulating, crosslinkable copolyester, said mixture comprising:
- (a) at least one oligomer having functional ##STR10## end groups, and (b) at least one oligomer having functional C.sub.3 CO.sub.2 -- end groups, and one of the oligomers has more than two of said functional end groups present in the oligomer for functioning to form said copolyester.
Dependencies are inferred from the claim text.