Packing structure for container for semiconductor wafer and packing method for container

A packing structure for a container for containing particle sensitive articles comprising:

• a polypropylene box, and
• upper and lower pressing members positioned within the box for sandwiching a container for containing particle sensitive articles, wherein the upper and lower pressing members comprise molded olefinic resin sheets;
• the lower pressing member comprising four side walls having a small tilt toward the inside which rise from near the periphery of the lower end thereof, and an upper surface having at least one depressed portion having at least a pair of side walls which can tightly set at least a pair of side walls of the lower portion of the container, the periphery of the lower end of the lower pressing member being formed to tightly fit to four inner side walls of the box;
• and the upper pressing member comprising a lower surface having at least one depressed portion having at least a pair of side walls which can tightly set at least a pair of side walls of the upper portion of the container, the periphery of the upper end of the upper pressing member being formed to tightly fit to the four inner side walls of the box.