Method of and apparatus for transferring circular object
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsTsutomu Sahoda, Koji Ueda, Hidenori Miyamoto, Toru Arikawa
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AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsTsutomu Sahoda, Koji Ueda, Hidenori Miyamoto, Toru Arikawa
Estimating the term…
When a carrier arm is retracted, a semiconductor wafer carried thereon passes between three light-emitting elements and three light-detecting elements associated therewith. At this time, a controller determines six points on the outer circumferential edge of the semiconductor wafer based on signals from sensors made up of the light-emitting elements and the light-detecting elements. The controller selects three of the determined points, determines the center of a circumscribed circle passing through the selected three points, and regards the determined center as the center of the semiconductor wafer. Then, the controller controls movement of the semiconductor wafer toward a rotary-cup coating device, an evacuating drying device, or an edge cleaning device based on the center of the semiconductor wafer.
A method of transferring a circular object, comprising the steps of:
An apparatus for transferring a circular object, comprising:
A method of transferring a circular object, comprising the steps of:
Dependencies are inferred from the claim text.