Cooling apparatus for electronic device

A cooling apparatus for an electronic device comprising a plurality of heat-generating semiconductor parts mounted on a board and a plurality of heat sinks attached onto said plurality of heat-generating semiconductor parts, respectively, to be thermally coupled thereto to dissipate heat of said heat-generating semiconductor parts by flow of a refrigerant such as air, said cooling apparatus comprising nozzles provided on opposite side surfaces of heat-generating semiconductor part fitted side surfaces of said plurality of heat sinks to supply said refrigerant to said plurality of heat sinks, each of said nozzles having a substantially rectangular cross section parallel to the board, and being made such that the ratio (R) of a distance (Wd) between the adjacent heat sinks to a pitch (Pitch=Wf+Wd) of said plurality of heat sinks is not less than 0.02 and below 0.06, and the ratio (Wn/Wf) of a nozzle width (Wn) in a direction that said refrigerant flows within said heat sinks to a heat sink width (Wf) in the said direction is not less than 0.20 and not more than 0.41.

A cooling apparatus for an electronic device comprising a plurality of heat-generating semiconductor parts mounted on a board and a plurality of heat sinks attached onto said plurality of heat-generating semiconductor parts, respectively, to be thermally coupled thereto to dissipate heat of said heat-generating semiconductor parts by flow of a refrigerant such as air, said cooling apparatus comprising nozzles provided on opposite side surfaces of heat-generating semiconductor part fitted side surfaces of said plurality of heat sinks to supply said refrigerant to said plurality of heat sinks, each of said nozzles having a substantially rectangular cross section parallel to the board, and being made such that a ratio (R) of a distance (Wd) between the adjacent heat sinks to a pitch (Pitch=Wf+Wd) of said plurality of heat sinks is not less than 0.06 and below 0.12, and a ratio (Wn/Wf) of a nozzle width (Wn) in a direction that said refrigerant flows within said heat sinks to a heat sink width (Wf) in the said direction is not less than 0.21 and not more than 0.46.

A cooling apparatus for an electronic device comprising a plurality of heat-generating semiconductor parts mounted on a board and a plurality of heat sinks attached onto said plurality of heat-generating semiconductor parts, respectively, to be thermally coupled thereto to dissipate heat of said heat-generating semiconductor parts by flow of a refrigerant such as air, said cooling apparatus comprising nozzles provided on opposite side surfaces of heat-generating semiconductor part fitted side surfaces of said plurality of heat sinks to supply said refrigerant to said plurality of heat sinks, each of said nozzles having a substantially rectangular cross section parallel to the board, and being made such that the ratio (R) of a distance (Wd) between the adjacent heat sinks to a pitch (Pitch=Wf+Wd) of said plurality of heat sinks is not less than 0.12 and below 0.20, and the ratio (Wn/Wf) of a nozzle width (Wn) in a direction that said refrigerant flows within said heat sinks to a heat sink width (Wf) in the said direction is not less than 0.22 and not more than 0.48.

A cooling apparatus for an electronic device comprising a plurality of heat-generating semiconductor parts mounted on a board and a plurality of heat sinks attached onto said plurality of heat-generating semiconductor parts, respectively, to be thermally coupled thereto to dissipate heat of said heat-generating semiconductor parts by flow of a refrigerant such as air, said cooling apparatus comprising nozzles provided on opposite side surfaces of heat-generating semiconductor part fitted side surfaces of said plurality of heat sinks to supply said refrigerant to said plurality of heat sinks, each of said nozzles having a substantially rectangular cross section parallel to the board, and being made such that the ratio (R) of a distance (Wd) between the adjacent heat sinks to a pitch (Pitch=Wf+Wd) of said plurality of heat sinks is not less than 0.20 and below 1.00, and the ratio (Wn/Wf) of a nozzle width (Wn) in a direction that said refrigerant flows within said heat sinks to a heat sink width (Wf) in the said direction is not less than 0.23 and not more than 0.50.