Multi-chip electrically reconfigurable module with predominantly extra-package inter-chip connections

Abstract

An electrically reconfigurable multi-chip module (MCERD) comprises three electrically reconfigurable integrated circuits (ERICs) enclosed in a package. The package provides for more "extra-package" connections between the ERICs and package pins than it does "intra-package" inter-chip connections. However, configuration connections between ERICs are intra-package. The MCERD is mounted on a daughterboard which provides connections between package pins and between package pins and pins of the daughterboard. The connections between package pins define "extra-package inter-chip" connections that typically far exceed the number of intra-package inter-chip connections. The connections between package pins and daughterboard pins connect the MCERD to a host system when the daughterboard is mounted on the host system motherboard. When the MCERD and daughterboard are installed in a host system, the MCERD can be electrically configured and then operated as configured. A feature of this MCERD is that a system developer can configure the inter-chip connections by appropriate design of the daughterboard.

Dependencies are inferred from the claim text.