US 5,702,568 AGranted

Method of forming a via hole of a semiconductor device with spin-on-glass film sealed by an oxide film

AssigneeHyundai Electronics Industries Co., Ltd.

InventorsChan Soo Shin, Choon Hwan Kim

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Abstract

The present invention discloses a method of forming a via hole of a semiconductor device, which includes the steps of: forming a plurality of first metal wires on a wafer; after coating a SOG film on the first oxide film, forming a groove in the SOG film using a mask in which a via hole contact is formed, the size of which is bigger than that of the real via hole to be formed in it; performing a process of filling up completely the groove portion (a two-step process for the first embodiment or a one-step process for the second embodiment); and forming a via hole using a contact mask the size of which is the same as that of the real via hole.

Claims1

Dependent claims

A method of forming a via hole of a semiconductor device, comprising the steps of:

providing a wafer having a plurality of metal wires;
forming a first oxide film on said wafer including said metal wires;
coating a first SOG film on said first oxide film;
forming a groove of a first cross sectional width by overetching a portion of said first SOG film enough to expose a portion of said first oxide film;
forming a second thin oxide film on said first SOG film in which said groove is formed;
filling up said groove by coating a second SOG film on said second oxide film;
to form a via hole having a second cross sectional width smaller than said first cross sectional of said groove;
and
removing a remaining portion of said second SOG film.

6 more elements

Dependencies are inferred from the claim text.