US 5,672,282 A · Process to preserve silver metal while forming integrated circuits

Abstract

A process to form integrated circuits comprising silver metal circuits. Deposition techniques such as sputtering, not plating, upon substrates to form such silver metal circuits are common. However in the conventional processes to remove the resist and the metal overlaying the resist, these conventional processes are deleterious to the silver metal. Thereby a new process is provided. This new process entails the metal overlaying the resist of the wafer is initially removed by a high pressure force. The resist, in this new process, is then removed by a benign stripper solution having the temperature of the solution raised to the highest temperature without degrading the stripper solution and said circuit is exposed to said stripper solution for one to five minutes.

Claims10

Dependent claims

A method of making an integrated circuit;

said method entails:
a) providing a substrate divided into a first area and a second area;
b) applying a resist material upon said first area of substrate;
c) applying a conductive metal composite comprising silver upon said resist and said second area of said substrate to a desired depth;
and the method is characterized in the steps of:
d) applying a high pressure force to said circuit to remove said metal overlaying said resist, and
e) applying a benign stripping solution having the temperature of the solution raised to the highest temperature without degrading the stripper solution and said circuit is exposed to said stripper solution for one to five minutes.

4 more elements

Dependencies are inferred from the claim text.

Process to preserve silver metal while forming integrated circuits

Life of this patent

Process to preserve silver metal while forming integrated circuits

Life of this patent

Abstract

Claims10