Lead-frame forming material
AssigneeFuji Photo Film Co., Ltd.
InventorsYasuhito Naruse, Kiyoshi Kamitani, Akio Uesugi, Tsutomu Kakei, Gouichi Morohoshi
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Abstract
Disclosed are a positive type lead-frame forming material which contains a light-sensitive material comprising an o-quinonediazide compound and a novolak resin, and a positive type lead-frame forming material which contains a positive resist composition comprising (1) a water-insoluble but alkaline water-soluble resin, (2) a compound capable of generating an acid by irradiation with active rays or radiant rays, and (3) a compound containing a group decomposable by acid which can increase its solubility in an alkaline developer through the action of the acid.
Claims4
A lead-frame forming material which is prepared by coating a light-sensitive material on both surfaces of a metal web of copper, a copper alloy or a nickel alloy, drying the resulting coated light-sensitive layer to form a coated metal web, and winding the coated metal web into a roll or cutting the coated web into strips of a fixed length and stacking said strips, wherein the light-sensitive material comprises an o-quinonediazide compound and a novolak resin, and
- wherein the light-sensitive material further contains a water-insoluble but alkaline water-soluble high molecular weight compound containing a --SO.sub.2 --NH-- bond on its side or main chain.
A lead-frame forming material which is prepared by coating a light-sensitive material on both surfaces of a metal web of copper, a copper alloy or a nickel alloy, drying the resulting coated light-sensitive layer to form a coated metal web, and winding the coated metal web into a roll or cutting the coated web into strips of a fixed length and stacking said strips, wherein the light-sensitive material comprises an o-quinonediazide compound and a novolak resin, and
- wherein protrusions having a height of from 0.5 .mu.m to 30 .mu.m are provided on the surface of the light-sensitive layer.
A lead-frame forming material which is prepared by coating a light-sensitive material on both surfaces of a material web made of copper, a copper alloy or a nickel alloy, drying the resulting coated light-sensitive layer to form a coated metal web, and winding the coated metal web into a roll or cutting the coated web into strips of a fixed length and stacking said strips, wherein the light-sensitive material is a positive resist composition which comprises:
- (1) a water-insoluble but alkaline water-soluble resin,
- (2) a compound capable of generating an acid by irradiation with active rays or radiant rays, and
- (3) a compound containing a group decomposable by acid which can increase it solubility in an alkaline developer through the action of the acid;
- and
- wherein the light-sensitive material contains a water-insoluble but alkaline water-soluble high molecular weight compound containing a --SO.sub.2 --NH-- bond on its side or main chain.
A lead-frame forming material which is prepared by coating a light-sensitive material on both surfaces of a material web made of copper, a copper alloy or a nickel alloy, drying the resulting coated light-sensitive layer to form a coated metal web, and winding the coated metal web into a roll or cutting the coated web into strips of a fixed length and stacking said strips, wherein the light-sensitive material is a positive resist composition which comprises:
- (1) a water-insoluble but alkaline water-soluble resin,
- (2) a compound capable of generating an acid by irradiation with active rays or radiant rays, and
- (3) a compound containing a group decomposable by acid which can increase it solubility in an alkaline developer through the action of the acid;
- and
- wherein protrusions having a height of from 0.5 .mu.m to 30 .mu.m are provided on the surface of the light-sensitive layer.
Dependencies are inferred from the claim text.