Semiconductor device and method of manufacturing the same
AssigneeMatsushita Electronics Corporation
InventorsYasuhiro Shimada, Atsuo Inoue, Koji Arita, Toru Nasu, Yoshihisa Nagano, Akihiro Matsuda
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AssigneeMatsushita Electronics Corporation
InventorsYasuhiro Shimada, Atsuo Inoue, Koji Arita, Toru Nasu, Yoshihisa Nagano, Akihiro Matsuda
Estimating the term…
A semiconductor device comprises silicon substrate 1 on which an integrated circuit is formed, first insulating layer 6 formed on silicon substrate 1, a capacitor comprising lower electrode 7 formed on first insulating layer 6, dielectric film 8 having a high dielectric constant and upper electrode 9, a second insulating film 11 having contact holes 13 which lead to lower electrode 7 and upper electrode 9 independently, diffusion barrier layer 17 which touches lower electrode 7 and upper electrode 9 at the bottom of contact holes 13, and interconnection layer 15 formed on diffusion barrier layer 17. In diffusion barrier layer 17 at the bottom of contact hole 13, a lamellar region made of granular crystal is formed.
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.