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US 5,626,169 AGranted
Device for bending leads of a lead frame
AssigneeFico B.V.
InventorVan Dalen W. Adrianus
Life of this patent
Estimating the term…
Abstract
The leads of a lead frame on which an encapsulated chip is placed are bent by placing them in a mould and subsequently bending them with a bending tool in the form of a cylinder-like roller rotatable round a rotating shaft. Because the roller rolls off over the leads, scraping off of solder onto the leads is prevented during bending. In view of its length the mounting of such a roller causes problems, such as sagging. This is resolved according to the invention by providing the roller on the periphery with slot-like recesses for passage of a bearing for the rotating shaft.
Claims6
A device for bending leads of a lead frame comprising:
- two mould halves which are movable relative to each other and which are movable between an open position and a closed position leaving free a space for receiving the lead frame, wherein the leads are supported on edges of the mould halves;
- and
- a movable bending tool in the form of a cylinder-like roller is rotatably mounted on a rotating shaft and said roller having at least one slot-like recess between first and second ends of the roller, for passage of a bearing for the rotating shaft.
Dependencies are inferred from the claim text.