Electronic circuit module having improved cooling arrangement

An electronic circuit module comprising

• a plurality of first terminals (13);
• a plurality of second terminals (31);
• an insulating container (10) having two surfaces with a depression in one of said two surfaces, said depression holding an electronic component therein, said plurality of first terminals being formed on one of said two surfaces of said insulating container and in electrical contact with said electronic component;
• a metal board (20) having at least two surfaces and at least one hollow tube therein for passing a coolant therethrough, said insulating container being mounted on said metal board so that another of said two surfaces of said insulating container is in contact with said one of said two surfaces of said metal board;
• a printed circuit board (30) having two surfaces and disposed on said insulating container so that one of said two surfaces of said printed circuit board is in contact with said one of said two surfaces of said insulating container and mounted in parallel to said metal board, said plurality of second terminals being formed on said one of said two surfaces of said printed circuit board and in electrical contact with said electronic component;
• and
• surface contact connectors (80) positioned between each of said plurality of first terminals and each of said plurality of second terminals to form an electrical contact therebetweeen;
• whereby cooling is achieved without increased cooling surface area.