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US 5,490,796 AGranted
IC socket equipped with dust discharge means
AssigneeYamaichi Electronics Co., Ltd.
InventorsRyuichi Nakamura, Kazunori Nakano
Life of this patent
Estimating the term…
Abstract
An IC socket equipped with a dust discharge device includes an IC socket body having a plurality of contacts electrically connected in a pressed condition to a plurality of leads of an IC package, and a dust discharge duct mounted on the IC socket body end adapted to allow for the discharge of dust produced or generated from the leads or body of the IC package. An upper end of the dust discharge duct opens adjacent the positions of the leads.
Claims18
An IC socket comprising:
- an IC socket body having an IC receiving portion for receiving an IC package, and a pedestal provided at a lower portion of said IC receiving portion, said IC receiving portion including an IC body receiving portion for receiving an IC body of the IC package, said pedestal having an IC lead supporting surface located outwardly from said IC body receiving portion for supporting IC leads of said IC package;
- a plurality of contacts mounted to said IC socket body for respectively pressing against the IC leads to create electrical connections when said IC package is received in said IC receiving portion and said IC leads are supported on said IC lead supporting surface;
- and
- wherein a dust discharge opening is formed in said pedestal through said IC lead supporting surface thereof, said dust discharge opening having an edge portion which contacts the IC leads of the IC package when the IC body is received in said IC body receiving portion and the IC leads are supported on said IC lead supporting surface.
1 more element
An IC socket for use with an IC package having an IC body and IC leads, said IC socket comprising:
- an IC socket body having an IC receiving portion and a pedestal provided at a lower portion of said IC receiving portion, said pedestal having an outer edge and an IC lead receiving surface located inwardly from said outer edge;
- a plurality of contacts respectively having mounting portions mounted to said socket body outwardly from said outer edge of said pedestal, and IC lead contacting portions respectively movably mounted to said IC socket body for movement relative to said socket body between IC lead contacting positions in which said IC lead contacting portions are located adjacent said IC lead receiving surface, and IC lead releasing positions in which said IC lead contacting portions are located outwardly from said IC lead contacting positions;
- and
- wherein a dust discharge duct is formed in said pedestal through said IC lead receiving surface thereof, said dust discharge duct being disposed inwardly from said outer edge of said pedestal.
1 more element
An IC socket comprising:
- an IC socket body having a plurality of contacts for pressing against and electrically connecting to a plurality of leads of an IC package when the IC package is mounted on said IC socket body;
- and
- wherein a dust receiving pan is mounted to said IC socket body and is formed as a separate member with respect to said IC socket body;
- wherein said IC socket body includes a dust discharge duct adapted to allow dust, produced or generated from the leads or a body of the IC package, to drop therethrough, an upper end of said dust discharge duct being open to a location below where the leads are positioned when the IC package is mounted on said IC socket body wherein a lower end of said dust discharge duct comprises a lower opening which is open to a lower surface of said IC socket;
- and
- wherein said lower opening is formed in said dust receiving pan.
3 more elements
Dependencies are inferred from the claim text.