Organic stripping composition

In a stripping composition for photoresists which are associated with a metal or metal alloy substrate comprising:

• (a) from about 50 to 98% by weight of an amide compound of the formula:
• ##STR9## wherein R is selected from the group consisting of hydrogen, lower alkyl and phenyl, R.sub.1 and R.sub.2 are selected from the group consisting of hydrogen and lower alkyl;
• and R and R.sub.1 together with the keto and nitrogen group to which they are attached form a five or six membered ring,
• (b) from about 1 to 49% by weight of an amine compound of the formula:
• ##STR10## wherein R.sub.4 is selected from the group consisting of --C.sub.2 H.sub.5, --C.sub.2 H.sub.4 OH, phenyl and CH.sub.2 CH(OH)CH.sub.3, R.sub.4 is selected from the group consisting of hydrogen, lower alkyl, alkanol and phenyl, and R.sub.5 is selected from the group consisting of hydrogen, lower alkyl and --C.sub.2 H.sub.4 OH, and R.sub.3 and R.sub.4 together with the nitrogen group to which they are attached form a five or six membered;
• ring, the improvement which comprises including about 0.5 to 20% by weight of 8-hydroxyquinoline, said 8-hydroxyquinoline being an inhibitor which forms a stable 5 or 6-membered coordination complex with a metal on said substrate selected from the group consisting of Al, Zn, Cr, Ti, Ta, Ni, Cu, Ga, As, and alloys thereof whereby said complex inhibits oxidation, of said substrate.