Modular power circuit assembly
AssigneeSGS-Thomson Microelectronics S.A.
InventorsGiuseppe Libretti, Paolo Casati
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AssigneeSGS-Thomson Microelectronics S.A.
InventorsGiuseppe Libretti, Paolo Casati
Estimating the term…
A modular construction power circuit arrangement is disclosed which comprises a thin metal plate performing holder and heat sink functions, a multiplicity of electronic devices in the form of semiconductor material chips having metalized pads as their terminals, a printed circuit board attached to the thin metal plate, electric conductors between the metalized pads and the printed circuit on the board, terminating connectors which form a part of the printed circuit board for connecting the circuit arrangement to external circuits, and a plastics material body which conglomerates a portion of the thin metal plate, the semiconductor material chips, and the printed circuit board. At least one of the semiconductor material chips is attached directly to the thin metal plate and extends therefrom through an opening in the printed circuit board.
A modular construction power circuit assembly comprising;
A modular power circuit assembly comprising:
The assembly according to clam 5 wherein said electrically insulating layer is a distinct layer positioned between said circuit board an said base plate, said distinct layer having an aperture therethrough coinciding with the aperture through said printed circuit board.
A modular power circuit assembly comprising:
A modular power circuit assembly comprising:
Dependencies are inferred from the claim text.