Fully CMOS-type SRAM device with grounding wire having contact holes
AssigneeNEC Corporation
InventorsJunji Kiyono, Yasushi Yamazaki
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AssigneeNEC Corporation
InventorsJunji Kiyono, Yasushi Yamazaki
Estimating the term…
A grounding wiring layer is provided on the substantially entire region between driver MOS transistors and load MOS thin film transistors of a flip-flop type memory cell. The contact holes for connecting the gate electrodes of the MOS thin film transistors with storage nodes are formed by providing a side wall on the inner wall of each of the contact hole portions formed in the grounding wiring layer and inter-layer insulating films sandwiching it. Thus, the impedance of the grounding wiring layer can be reduced to stabilize the operation of a miniaturized SRAM memory cell using the load MOS thin film transistors. The resistance against soft error caused by .alpha.-ray can also be improved.
A fully CMOS-type static random access memory device comprising;
Dependencies are inferred from the claim text.