Resist compositions
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsYoshihumi Takeda, Toshinobu Ishihara, Ken'ichi Itoh, Kazumasa Maruyama
Life of this patent
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Abstract
A resist composition comprising a base resin, an acid release agent, and a dissolution inhibitor is improved in sensitivity and resolution when the base resin is typically selected from poly-t-butoxystyrene/poly-hydroxystyrene, poly-t-butoxystyrene/poly-p-methoxymethoxystyrene/polyhydroxystyrene, and poly-t-butoxystyrene/poly-p-methoxystyrene/polyhydroxystyrene copolymers. The composition forms a resist useful for the manufacture of LSI.
Claims12
A resist composition comprising a base resin, an acid release agent capable of generating an acid upon exposure to light, and a dissolution inhibitor containing an acid unstable group, said base resin being represented by the following rational formula (1), (2) or (3):
- ##STR29## wherein each of R.sup.1 and R.sup.3 is a hydrogen atom or methyl group, R.sup.2 is a tert-butyl group, and letters a and b satisfy a+b=1, ##STR30## wherein each of R.sup.1, R.sup.3 and R.sup.5 is a hydrogen atom or methyl group, R.sup.4 is a tert-butyl group, R.sup.6 is an acid hydrolyzable group selected from the group consisting of methoxymethyl, tetrahydro-pyranyl, trialkylsilyl, isopropoxymethyl, tetrahydrofuranyl, and tert-butoxycarbonyl groups, and letters c, d and e satisfy c+d+e=1, ##STR31## wherein each of R.sup.1, R.sup.3 and R.sup.5 is a hydrogen atom or methyl group, R.sup.7 is selected from the group consisting of tert-butyl, methoxymethyl, tetrahydropyranyl, and trialkylsilyl groups, and R.sup.8 is a lower alkoxy group or a hydrogen atom, and letters f, g and h satisfy f+g+h=1.
Dependencies are inferred from the claim text.