Method of fabricating of semiconductor device by forming two electrically insulated wells of the same type electroconductivity on semiconductor substrate
AssigneeNEC Corporation
InventorTakahisa Migita
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AssigneeNEC Corporation
InventorTakahisa Migita
Estimating the term…
A fabrication method of a semiconductor device in which the characteristic deterioration of the device due to electric charges generating in the fabrication process can be prevented. A first well of a first electroconductive type is formed on a semiconductor substrate of the first electroconductive type. The first well is surrounded by a semiconductor layer of a second electroconductive type opposite to the first electroconductive type. A second well of the first electroconductive type, which is insulated from the first well and connected to the substrate, is formed on the substrate. An electroconductive layer for connecting the first and second wells. The electroconductive layer is partially removed to insulate the first and second wells after finishing a process having a possibility for generating electric charges on the substrate.
A fabrication method of a semiconductor device comprising the steps of:
A fabrication method of a semiconductor device comprising the steps of:
Dependencies are inferred from the claim text.