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AssigneeKabushiki Kaisha Toshiba
InventorsMasayuki Oba, Rumiko Hayase, Naoko Kihara, Shuzi Hayase, Yukihiro Mikogami, Yoshihiko Nakano, Naohiko Oyasato, Shigeru Matake, Kei Takano
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Disclosed is a photosensitive resin composition, containing a polyamic acid derivative having a repeating unit represented by general formula (1) given below and a photosensitive agent: ##STR1## where, R.sup.1 represents a tetravalent organic group, R.sup.2 represents a divalent organic group, and R.sup.3 and R.sup.4 represent a monovalent organic group, at least one of R.sup.3 and R.sup.4 being an organic group having at least on hydroxyl group bonded to an aromatic ring. A semiconductor substrate is coated with the photosensitive resin composition, followed by exposing the coated film to light through a patterning mask and subsequently applying a development and a heat treatment so as to form a polyimide film pattern. A baking treatment also be applied immediately after the exposure step. The photosensitive resin composition of the present invention performs the function of a positive or negative photoresist film and the function of a polyimide protective film on a semiconductor substrate.
A photosensitive resin composition for forming a polyimide film pattern, comprising in admixture a polyamic acid derivative having a repeating unit represented by general formula (1), and a photosensitizing amount of an o-quinone diazide compound photosensitive agent:
A photosensitive resin composition for forming a polyimide film pattern, comprising in admixture a polyamic acid derivative having a repeating unit represented by general formula (1), a polyamic acid having a repeating unit represented by general formula (2), and a photosensitizing amount of an o-quinone diazide compound photosensitive agent:
A photosensitive resin composition for forming a polyimide film pattern, comprising in admixture a polyamic acid derivative having a copolymer structure including a repeating unit represented by general formula (1) and a repeating unit represented by general formula (2), and a photosensitizing amount of an o-quinone diazide compound photosensitive agent:
Dependencies are inferred from the claim text.