IC socket
AssigneeYamaichi Electronics Co., Ltd.
InventorHideki Sagano
Life of this patent
Estimating the term…
Abstract
An IC socket comprising a plurality of partition walls disposed along an IC platform and contacts which are to be brought into pressure contact with leads of an IC package mounted on the IC platform, the contacts being inserted into corresponding slits formed between adjacent the partition walls so that the contacts are orderly arranged with respect to the leads of the IC package, a foremost end face of each of the leads of the IC package being restricted by wall surfaces of a pair of adjacent partition walls for isolating the slits so that the leads are correctly positioned.
Claims2
An IC socket comprising a plurality of partition walls disposed along an IC platform and contacts which are to be brought into pressure contact with leads of an IC package mounted on said IC platform, said contacts being inserted into corresponding slits formed between adjacent said partition walls so that said contacts are orderly arranged with respect to the leads of said IC package, a foremost end face of each of the leads of said IC package being restricted by wall surfaces of a pair of adjacent partition walls for isolating said slits so that the leads are correctly positioned.
Dependencies are inferred from the claim text.