Process for forming low resistance contacts between silicide areas and upper level polysilicon interconnects
AssigneeMicron Technology, Inc.
InventorsMonte Manning, Steve V. Cole, Tyler A. Lowrey
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Abstract
A process for forming low resistance contacts between silicide areas and upper level polysilicon interconnect layers including a specific doping technique that provides solid low resistance contacts between a lower level of a silicided area and an upper level polysilicon interconnect. The doping technique combines a doping implant of the upper level polysilicon and an ion-mixing implant into a single implant thereby achieving a low resistive implant which also reduces processing steps.
Claims12
A process for forming low resistance interconnects between an active area having a silicided surface, and an upper level polysilicon layer, in a process used for fabrication of a semiconductor device on a silicon wafer substrate, said process comprising:
- a) forming said active area into said wafer substrate;
- b) forming said silicided surface from a layer of metal deposited on said active area;
- c) forming a dielectric over existing materials residing over said wafer surface;
- d) providing openings to said silicided surface at interconnect locations;
- e) depositing a layer of said upper level polysilicon on said dielectric and into said openings to thereby form said silicided surface;
- and
- f) implanting a dopant impurity of arsenic at a dose of approximately 5.times.10.sup.15 atoms/cm.sup.2 at an implanting energy of approximately 180 keV into said upper level polysilicon layer being approximately 1000.ANG. thick, thereby conductively doping said layer of upper level polysilicon;
- wherein a major portion of implanted conductive impurities reside at the interface between said upper level polysilicon and said silicided surface, thereby forming low resistive contacts between said silicide surfaced active areas and said conductively doped upper level polysilicon.
A process for forming low resistance interconnects between a lower level conductively doped polysilicon having a silicided surface, and an upper level polysilicon layer, in a process used for fabrication of a semiconductor device on a silicon wafer substrate, said process comprising:
- a) forming said silicided surface from a layer of metal deposited on said lower level conductively doped polysilicon;
- b) forming a dielectric over existing materials residing over said wafer surface;
- c) providing openings to said silicided surface at interconnect locations;
- d) depositing a layer of said upper level polysilicon on said dielectric and into said openings to thereby form said silicided surface;
- and
- e) implanting a dopant impurity of arsenic at a dose of approximately 5.times.10.sup.15 atoms/cm.sup.2 at an implanting energy of approximately 180 keV into said upper level polysilicon layer being approximately 1000.ANG. thick, thereby conductively doping said layer of upper level polysilicon;
- wherein a major portion of implanted conductive impurities reside at the interface between said Upper level polysilicon and said silicided surface, thereby forming resistive contacts between said silicide surfaced lower level conductively doped polysilicon and said conductively doped upper level polysilicon.
Dependencies are inferred from the claim text.