Method and apparatus of coupling a die to a lead frame with a tape automated bonded tape that has openings which expose portions of the tape leads

An integrated circuit package, comprising:

• a rectangular die which has a plurality of pads along each edge of said die;
• a rectangular lead frame having a lead frame center opening and a plurality of leads arranged along each edge of said lead frame opening;
• and,
• a rectangular coupling tape having a layer of dielectric which supports a plurality of tape leads that couple said pads of said die with said leads of said lead frame, said layer of dielectric having a rectangular center opening defined by four sides, said rectangular coupling tape further having four groups of contact openings each group being adjacent to a side of said center opening and a plurality of contact openings which expose contact portions of said tape leads, each group having at least two adjacent contact openings.

A method for constructing an integrated circuit package, comprising the steps of:

• a) providing a coupling tape which has a layer of dielectric which supports a plurality of tape leads, said layer of dielectric having a center opening defined by four sides, said tape further having four groups of contact openings each group being adjacent to a side of a said center opening and which expose contact portions of tape leads, each group having at least adjacent contact openings;
• c) placing said coupling tape adjacent to a die such that said exposed contact portions are aligned with a plurality of pads of an integrated circuit;
• and,
• d) attaching said exposed contact portions to said pads.