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US 5,345,038 AGranted
Multi-layer ceramic packages
AssigneeKyocera America, Inc.
InventorsNobuaki Miyauchi, Takatoshi Irie
Life of this patent
Estimating the term…
Abstract
A method for making multi-layer ceramic packages. The method provides for attaching contact pins to a ceramic substrate after the application of an intermediate metal layer and an outer metal layer. This eliminates plating the contact pins with an intermediate metal layer and an outer metal layer, thereby saving material and process time.
Claims9
A multi-layer ceramic package having a ceramic substrate, metallic wire bonding areas, die attach area, and external bonding pads, including:
- (a) an intermediate metal layer covering the wire bonding areas, die attach area, and external bonding pads;
- (b) an outer metal layer covering the intermediate metal layer on the wire bonding areas, die attach area, and external bonding pads;
- and
- (c) contact pins coupled to the outer metal layer covering the intermediate metal layer on the external bonding pads on the ceramic substrate.
1 more element
A multi-layer package including:
- (a) a ceramic substrate metallic wire bonding areas, die attached area, and external bonding pads;
- (b) an intermediate metal layer covering the wire bonding areas, die attach area, and external bonding pads;
- (c) an outer metal layer covering the intermediate metal layer on the wire bonding areas, die attach area, and external bonding pads;
- (d) contact pins coupled to the outer metal layer covering the intermediate metal layer on the external bonding pads on the ceramic substrate.
1 more element
Dependencies are inferred from the claim text.