Method for encapsulating semiconductor devices with package bodies

A method for encapsulating semiconductor devices, each device including a package body and a molded carrier ring surrounding each package body, the method comprising the steps of:

• providing a mold having at least one mold platen, the mold platen having a first cavity for defining a carrier ring shape and having a second cavity for accepting a first insert of predetermined dimensions, the first insert defining one of a plurality of user selectable package body widths and lengths and defining a third cavity within the second cavity for accepting a second insert of predetermined dimensions, the second insert defining a fourth cavity which determines a first one of a plurality of user selectable package body thicknesses and having an adjustable position within the third cavity to permit variation of the package body thickness;
• providing one or more shims which are positioned in the third cavity, the one or more shims determining the position of the second insert within the third cavity;
• providing a lead frame;
• attaching a semiconductor die to the lead frame;
• inserting the lead frame with the semiconductor die attached thereto into the mold;
• filling the fourth cavity formed by the second insert with plastic to form a package body which encapsulates the semiconductor die while keeping the first and second inserts stationary;
• filling the first cavity in the mold with plastic to form a molded carrier ring which surrounds the package body;
• removing the lead frame, the semiconductor die, and the package body from the mold;
• and
• adjusting the second insert within the first insert such that the second insert defines a second one of the plurality of user selectable package body thickness which is different than the first one of the plurality of user selectable package body thicknesses, wherein the second insert is adjusted while the first insert is held stationary.