Package for solid state imager with heating means to repair imager lattice defect

Abstract

A CCD image sensor includes a package (2) in which there are packaged a CCD solid state imaging device (1) in which a getter layer is formed on the rear surface of a silicon substrate and a photo-sensing portion and a CCD register are formed on the surface of the silicon substrate and a substrate electrode (3 ) of a plate configuration disposed on the lower surface of the CCD solid state imaging device (1 ). A heating device (5 ) is disposed on the lower surface of the substrate electrode (3 ) through an insulating material (4 ) of a plate configuration. The heating device (5) is formed of a resistance pattern (7) that is formed on the surface of an insulating body (6) of a plate configuration by a well-known thick film forming technique. A lattice defect that is caused by a metal ion or the like entered into the CCD solid state imaging device in accordance with an aging change can be repaired without disassembling the solid state image sensor. Thus, the occurrence of a fixed pattern noise on a reproduced picture can be reduced readily.

Dependencies are inferred from the claim text.