Semiconductor memory device and a method for producing the same
AssigneeSharp Kabushiki Kaisha
InventorsKenichi Tanaka, Keizo Sakiyama
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Abstract
A method for producing a semiconductor memory device including a volatile memory element, a non-volatile memory element, and a driver in combination on a silicon conductive substrate is provided. The volatile memory element is a DRAM and is disposed in and on a reverse-conductive well. A charge storage electrode layer of the DRAM is partly disposed on a transfer gate electrode layer with an insulating film sandwiched therebetween. The non-volatile memory element is a mask read-only memory and/or a programmable read-only memory.
Claims3
A method for producing a semiconductor memory device comprising the steps of:
- forming a first insulating film on a conductive silicon substrate in which a plurality of reverse conductive wells and a plurality of element separation regions are formed;
- forming a first polysilicon layer on the first insulating film;
- patterning the first polysilicon layer to form a floating gate electrode layer of a non-volatile memory element and a transistor gate electrode layer with a breakdown-voltage of 20 V or less;
- forming a second insulating film on the silicon substrate;
- forming a second polysilicon layer on the second insulating film;
- patterning the second polysilicon layer to form a logic electrode layer, a transfer gate electrode layer of a volatile memory element, a driver electrode layer, and a control gate electrode layer of a non-volatile memory element;
- forming a third insulating film on the silicon substrate;
- forming a third polysilicon layer on the third insulating film;
- and
- patterning the third polysilicon layer to form a charge storage electrode layer of a volatile memory element so that the charge storage electrode layer is partly disposed on the transfer gate electrode layer with the third insulating film sandwiched there-between.
Dependencies are inferred from the claim text.