Electroless plating catalyst
AssigneeShipley Company, L.L.C.
InventorJ. Claude Portner
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Abstract
The invention discloses a new electroless plating catalyst and a process of using the same for selective plating. The catalyst and process are especially adapted for formation of EMI shielding for electronic components. The electroless plating catalyst comprises catalytic particulates dispersed in a liquid film forming composition.
Claims31
An electroless plating catalyst solution comprising a polymer solution having a mixture of catalytic particles homogeneously dispersed therein, said mixture of catalytic particles comprising first catalytic particles of a reduced platinum family metal absorbed into an inert particulate carrier and second catalytic particles of reduced silver adsorbed onto an inert particulate carrier, said particles having a metals content whereby the weight ratio of silver to the platinum family metal varies between about 100:1 and 1:1.
An electroless plating catalyst solution consisting essentially of a polymer solution having a mixture of catalytic particles homogeneously dispersed therein, said mixture of catalytic particles consisting essentially of first catalytic particles of reduced palladium absorbed onto an inert particulate silica carrier and second catalytic particles of reduced silver adsorbed onto an inert particulate carrier, said particles having a metal content whereby the weight ratio of silver to palladium varies between about 100:1 and 1:1.
Dependencies are inferred from the claim text.