US 5,212,627 A · Electronic module housing and assembly with integral heatsink

Abstract

An electronic module housing (30) with an integral heatsink (32) is provided as part of an electronic module assembly (31). The heatsink (32) has a general U-shape formed by a pair of opposing sidewalls (33, 34) rising upward from a central intermediate portion (37) having a planar surface (38) for mounting a module substrate thereon. Plastic housing material is molded about the heatsink so as to form an interior module receiving cavity (50). The cavity is generally defined by the heatsink sidewalls (33, 34) and a pair of molded plastic opposing sidewalls (55, 56) provided between the heatsink sidewalls. Preferably heat conductive mounting ear portions (40, 41) extend from ends (43, 44) of the heatsink sidewalls and permit thermally mounting the housing to another heatsinking structure. Preferably molded interior plastic sidewalls (57, 58) separate the heatsink sidewalls (33, 34) from the cavity (50). The preferred housing and assembly configuration has reduced size and weight and provides sufficient mechanical protection and increased thermal power dissipation for a module (39 ) in the cavity.

Claims20

Dependent claims

An electronic module housing with an integral heatsink, comprising:

a heatsink having a general U-shape configuration formed by a pair of upstanding opposing heatsink sidewalls rising upward from opposite ends of a central intermediate portion, said central intermediate portion having a planar surface suitable for mounting a substantially planar module substrate thereon;
and
plastic housing material molded and contacting said heatsink and forming an interior module receiving cavity, said interior cavity having an open side and generally defined by said pair of upstanding opposing heatsink sidewalls, said central intermediate portion of said heatsink and a pair of molded plastic opposing sidewalls provided between and extending between said pair of heatsink sidewalls, said pair of molded plastic opposing sidewalls rising upward from said central intermediate portion of said heatsink, whereby said heatsink provides said planar surface for mounting a module substrate thereto while said heatsink sidewalls can conduct heat away from said substrate and said heatsink and plastic sidewalls provide protection for components in said interior cavity.

An electronic module assembly with an integral heatsink, comprising:

a heatsink having a general U-shape configuration formed by a pair of upstanding opposing heatsink sidewalls rising upward from opposite ends of a central intermediate portion, said central intermediate portion having a planar surface suitable for mounting a substantially planar module substrate thereon;
plastic housing material molded and contacting said heatsink and forming an interior module receiving cavity, said interior cavity having an open side and generally defined by said pair of upstanding opposing heatsink sidewalls, said central intermediate portion of said heatsink and a pair of molded plastic opposing sidewalls provided between and extending between said pair of heatsink sidewalls, said pair of molded plastic opposing sidewalls rising upward from said central intermediate portion of said heatsink, whereby said heatsink provides said planar surface for mounting a module substrate thereto while said heatsink sidewalls can conduct heat away from said substrate and said heatsink and plastic sidewalls provide protection for components in said interior cavity;
and
circuit module which includes a substantially planar heat conductive substrate, said substrate planarly and heat conductively mounted to said central intermediate portion planar surface.

1 more element

Dependencies are inferred from the claim text.

Electronic module housing and assembly with integral heatsink

Life of this patent

Electronic module housing and assembly with integral heatsink

Life of this patent

Abstract

Claims20