Photosensitive resin composition

A photosensitive resin composition consisting essentially of:

• 30 to 90 parts by weight, based on 100 parts by weight of the components (I), (II) and (III), of crosslinked resin particles having a particle size of less than several mm prepared by dispersing in an aqueous medium the following four components:
• (a) 60 to 90% by weight, based on the total amount of the components (a), (b) and (c), of a base resin having a glass transition temperature (Tg) of 0.degree. C. or less and a polymerizable double bond,
• (b) 0.9 to 30% by weight, of based on the total amount of the components (a), (b) and (c), of a monomer which, when polymerized, provides a resin in which Tg is 20.degree. C. higher than that of said base resin, or a resin in which Tg is 20 .degree. C. higher than that of said base resin,
• (c) 0.1 to 10% by weight, based on the total amount of the components (a), (b) and (c) of a polyvinyl compound, and
• (d) 0.1 to 3 parts by weight, based on 100 parts by weight of the total weight of the components (a), (b) and (c), of a polymerization initiator, components (a), (b), (c) and (d) having been heated to crosslink,
• (II) 5 to 70 parts by weight, based on 100 parts by weight of the components (I), (II) and (III), of a photopolymerizable unsaturated monomer, and
• (III) 0.01 to 10 parts by weight, based on 100 parts by weight of the components (I), (II) and (III), of a photopolymerization initiator.