US 5,182,424 A · Module encapsulation by induction heating

Abstract

An induction heating module encapsulation apparatus and method for its use is disclosed. The apparatus comprises a substantially airtight chamber which is composed of ceramic or some other high temperature insulating material in which a cap and a ceramic substrate having semiconductor chips joined thereon are placed. A sealband of solder or other brazing material is placed at the periphery of the cap where the cap end substrate are to be joined. An RF coil, which serves as inductor in the apparatus, is energized by a high frequency generator, generating an electromagnetic field in the radio frequency spectrum. The RF coil is oriented to localize the inducted current at the periphery of the cap and the sealband. The inducted current is dissipated in the form of heat until the sealband is molten. The RF power is then turned off. The chamber is pressurized at this point to prevent heated air underneath the cap from breaching the integrity of the sealband by escaping through the sealband while it is in its molten state. After the sealband has been allowed to cool sufficiently to solidify, the pressure is reduced and the completed module is removed from the chamber. The entire encapsulation process requires ten to fifteen seconds per module assembly.

Claims7

Dependent claims

A method of encapsulating a ceramic substrate having at least one semiconductor chip joined thereon with a protective cap through the use of RF induction heating to melt a sealband placed in contact with said substrate and said cap near the periphery of said cap, comprising the steps of:

positioning said cap over said substrate so that said sealband is in contact with said cap near its periphery;
placing said cap and said substrate in a substantially airtight chamber;
forcing said cap and said substrate together to promote a good bond between said cap and said substrate, simultaneously forcing said cap in thermal contact with said sealband;
inducing a current in said cap with an electromagnetic field in an RF spectrum, said electromagnetic field concentrated at said cap near its periphery to reduce effects of said electromagnetic field on circuitry on said substrate and chip and to reduce power requirements, thereby heating said cap by induction heating and said sealband melts;
and,
creating air pressure within said chamber to prevent heated air within said cap from breaching said molten sealband until said sealband cools and solidifies.

3 more elements

Dependencies are inferred from the claim text.

Module encapsulation by induction heating

Life of this patent

Module encapsulation by induction heating

Life of this patent

Abstract

Claims7