Integrated circuit device having slanted peripheral circuits
AssigneeGE Solid State Patents, Inc.
InventorsStephen W. Morris, Richard P. Lydick
Life of this patent
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Abstract
The present invention sets forth an integrated circuit (IC) device wherein the IC chip includes peripheral circuits, such as input/output circuits, which are arranged non-perpendicular with respect to the rectangular shape of the active area of the IC. This structure permits positioning some of the terminal bond pads closely adjacent the corners of the chip without overlap of adjacent circuits.
Claims6
An integrated circuit chip of substantially rectangular shape having peripheral edges, a substantially rectangular area within said chip containing an integrated circuit spaced from said peripheral edges, a plurality of terminal bond pads disposed adjacent said peripheral edges of said chip, a plurality of peripheral circuits which interconnect said terminal bond pads to active elements of said integrated circuit, each of which is arranged in a generally elongated shape having a longitudinal axis and being disposed within said chip between a side of said rectangular area and a respective each of said terminal bond pads, at least one of said terminal bond pads being adjacent a corner of said chip, wherein each said longitudinal axis forms an angle with said side which is other than 90 degrees.
Dependencies are inferred from the claim text.