Sensitizing agent for electroless plating and method for sensitizing substrate with the agent
AssigneeHitachi Chemical Company, Ltd.
InventorsIsao Matuzaki, Kenzi Tonoki, Takehiko Ishibashi, Haruki Yokono
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Abstract
A sensitizing agent for electroless plating which comprises a solution of at least one of palladium (II), silver (I), copper (I), copper (II), and nickel (II) compounds in an amide and a method for sensitizing substrates made of plastics or ceramics which comprises treating the substrates with the sensitizing agent, followed by treating them with a reducing solution, are provided.
Claims6
A sensitizing agent which does not chemically attack copper oxide for electroless plating which consists of water or alcohol and a solution of at least one metal compound of a metal selected from the group consisting of palladium (II), silver (I), copper (I), copper (III), and nickel (II) dissolved in an amide;
- said agent having a pH in the range of 11 to 13 and the concentration of the metal compound in the agent being from 0.01 to 1.0% by weight.
A method for sensitizing a substrate to be electroless-plated which comprises treating the substrate with a sensitizing agent which does not chemically attack copper oxide, said agent consisting of water or alcohol and a solution of at least one metal compound of a metal selected from the group consisting of palladium (II), silver (I), copper (I), copper (II) and nickel (II) dissolved in an amide, said agent having a pH in the range of 11 to 13 and concentration of the metal compound in the agent being from 0.01 to 1.0% by weight;
- and thereafter treating the substrate with a reducing solution to provide a metallic form of said metal on said substrate.
Dependencies are inferred from the claim text.