Method of manufacture of EMI/RFI vapor deposited composite shielding panel
AssigneePennwalt Corporation
InventorWalter J. Miller
Life of this patent
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Abstract
An EMI/RFI shielding panel prepared by glow discharge treatment of a substrate material to provide a chemically reactive surface, and then successively vapor plating the surface with an adhesive layer of chromium or stainless steel, a shielding layer of copper or aluminum onto the adhesive layer, and then a protective layer of chromium or aluminum onto the shielding layer.
Claims9
A method of manufacturing a panel for shielding the passage of electromagnetic radio frequency interference therethrough, comprising:
- (a) subjecting a surface of an electrically insulating substrate sheet material to glow-discharge treatment to provide an active surface that is chemically reactive with vapors of chromium or stainless steel at an air pressure less than about 5.times.10.sup.-5 TORR;
- (b) vapor plating chromium or stainless steel onto said active surface to provide an adhesive layer of chromium or stainless steel chemically bound to said surface, said layer having a thickness within the range of about 300 Angstroms to about 1,000 Angstroms;
- (c) vapor plating an aluminum or copper shielding layer onto the adhesive layer of (b) prior to substantial oxidation of the adhesive layer surface, said shielding layer having a thickness within the range of about 1,000 Angstroms to about 50,000 Angstroms;
- and then
- (d) vapor plating a chromium protective layer onto said shielding layer of (c), said protective layer having a thickness of at least about 1,000 Angstroms;
- to provide a relatively low cost, durable, shielded panel for shielding the passage of electromagnetic radio frequency interference therethrough.
The method of manufacturing the panel in claim 10 wherein in (b), (c), and (d) the vapor plating is at an air pressure of less than about 5.times.10.sup.-5 TORR.
Dependencies are inferred from the claim text.