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US 4,399,484 AGranted
Integral electric module and assembly jet cooling system
AssigneeThe United States of America as represented by the Secretary of the Air Force
InventorArnold H. Mayer
Life of this patent
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Abstract
An improved printed circuit board housing assembly is described wherein localized high intensity cooling of heat dissipating electronic components mounted on the circuit boards may be accomplished by direct impingement of streams of fluid coolant onto individual components; when coolant is passed through the housing, fluid streams, generated at openings provided in the circuit boards, impinge onto electronic components mounted on the next circuit board downstream from the source of coolant flow.
Claims7
An improved electronics cooling system comprising:
- a. a housing having an inlet at one end thereof and an outlet at a second end thereof for passage of fluid coolant therethrough;
- b. holding means for maintaining a plurality of printed circuit boards in a spaced and generally parallel array within said housing;
- c. a plurality of printed circuit boards within said housing maintained in a spaced and generally parallel array by said holding means, each of said printed circuit boards having heat generating electronic components mounted thereon and including means defining passageways therethrough configured for passage of said fluid coolant by the formation of fluid jet streams, said passageways positioned to provide direct impingement of said streams onto each component mounted on the next successive board in said array for providing localized and highly efficient cooling to said components;
- and
- d. means for providing flow of fluid coolant through said housing.
2 more elements
Dependencies are inferred from the claim text.