Wafer tilt compensation in zone plate alignment system
AssigneeBell Telephone Laboratories, Incorporated
InventorsMartin Feldman, Alan D. White, Donald L. White
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Abstract
The present invention is a method and apparatus for aligning a semiconductor wafer to be patterned by a step-and-repeat photolithographic system. The inventive alignment technique, which is able to compensate for local wafer tilt and/or nonuniform photoresist thickness, is applicable to semiconductor wafers which have, on a surface portion, one or more Fresnel zone plate alignment marks.
Claims11
An apparatus for aligning a semiconductor wafer of the type that includes, on a surface portion of the wafer, image forming means that when illuminated by incident radiation forms at least a first focused image located a first prescribed distance from said surface and a second focused image located a second prescribed distance from said surface;
- said apparatus comprising:
- means for directing incident radiation onto said image forming means to form said first and second focused images;
- position sensing means;
- means for projecting said first and second focused images onto said position sensing means to form first and second projected images;
- means, responsive to said position sensing means, for moving said wafer,
- said position sensing means being adapted to determine when said first and second projected images are displaced from positions, preselected for each of said projected images, by amounts proportional to said first and second prescribed distances respectively;
- said moving means being adapted to move said wafer so that said first and second projected images are displaced from said positions, preselected for each of said projected images, by amounts proportional to said first and second prescribed distances, respectively;
- wherein said first and second focused images are real and virtual images respectively;
- said real image being located a first prescribed distance in front of said wafer surface and said virtual image being located a second prescribed distance behind said wafer surface;
- wherein said position sensing means comprises:
- at least one photodetector means adapted to generate electronic signals in response to said projected images;
- and
- comparator circuit means, operative in response to said signals, for electronically determining when said first and second projected images are displaced from said positions, preselected for each of said projected images, by amounts proportional to said first and second prescribed distances respectively;
- and
- wherein said position sensing means comprises a single photodetector means onto which said real and virtual images are projected to form said first and second projected images;
- the same position on said single detector means being preselected for each of said projected images.
Apparatus for aligning a semiconductor wafer of the type that includes on a surface portion thereof image forming means that when illuminated by incident radiation forms real and virtual focused images respectively spaced apart from said wafer surface in opposite directions, said apparatus comprising
- means for directing incident radiation at said image forming means to form said focused images,
- photodetector means responsive to projected focused images for providing electrical output signals determinative of whether or not said projected images form a preselected pattern on said detector means,
- means for projecting said real and virtual focused images onto said photodetector means to form projected focused images thereon,
- and means responsive to electrical signals provided by said photodetector means indicative of said real and virtual projected images not forming said preselected pattern for moving said wafer to a position at which said projected images form said preselected pattern on said photodetector means.
In an integrated circuit fabrication sequence in which a semiconductor wafer is to be patterned, the wafer being of the type that includes on a surface thereof image forming means that when illuminated by incident radiation forms real and virtual focused images respectively spaced apart from the wafer surface in opposite directions, a method for aligning said wafer comprising the steps of
- directing incident radiation at said image forming means to form said focused images,
- projecting said real and virtual images onto a photodetector to form projected focused images thereon,
- detecting whether or not said projected focused images form a preselected pattern on said photodetector,
- and, in the event said projected focused images do not form the preselected pattern, moving the wafer to a position at which said projected images do form said preselected pattern on said photodetector.
Dependencies are inferred from the claim text.