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US 4,394,678 AGranted
Elevated edge-protected bonding pedestals for semiconductor devices
AssigneeMotorola, Inc.
InventorsVern H. Winchell, II, Thomas A. Scharr, Lowell E. Clark
Life of this patent
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Abstract
An elevated bonding pad suitable for wire or lead frame attachment and having an insulating layer completely over its outer periphery. The structure simplifies the processing required to form an elevated bonding pad, and serves to protect the periphery against bonding damage, and provides protection against corrosion of the bonded encapsulated semiconductor unit.
Claims9
A bonding pedestal for a semiconductor circuit containing intra-circuit metallization comprising:
- a semiconductor substrate;
- a bonding pad having an outer aluminum layer and lying over a portion of said substrate, said outer aluminum layer comprising a peripheral portion and a central portion, said central portion having a substantially planar aluminum bonding surface, and wherein said bonding surface is higher than said peripheral portion;
- a hard core under said central portion of said bonding pad, lying over said substrate and conformally covered on sides and top by said outer aluminum layer which forms said peripheral portion and said bonding surface;
- and
- insulating means covering said peripheral portion but lying at a lower level than said bonding surface in a region surrounding said bonding pad.
2 more elements
A bonding pedestal for a semiconductor substrate comprising:
- a patterned aluminum layer;
- an insulating passivation layer lying on portions of said aluminum layer and having an aperture coincident with at least a part of said patterned aluminum layer;
- an elevated bonding pad portion in said aluminum layer having a substantially planar aluminum bonding surface which protrudes through said aperture and lies above said passivation layer in a region around said aperture;
- and
- a localized support element within said elevated bonding pad portion, conformally coated on sides and top by said aluminum layer, said support element having a thickness greater than that of said passivation layer and an area less than that of said aperture.
2 more elements
Dependencies are inferred from the claim text.